MediaTek announces first 5G SoC with integrated Helio M70 5G modem

On 29th of May, MediaTek has launched all new SoC for the 5G platform at Computex 2019.

MediaTek stated that their 5G mobile platform is based on the 7nm FinFET process and it is the world’s first smartphone chip that uses ARM’s latest and fastest Cortex A77 CPU and Mali-G77 GPU.

More importantly, it integrates the Helio M70 5G modem (Qualcomm is 5G supported by an external X50 or X55), with 4.7Gbps download speed and 2.5 Gbps upload speed, supporting 2G, 3G, 4G, 5G connectivity and dynamics. Power allocation to provide users with a seamless connection experience.

The official stressed that the 5G mobile platform released by MediaTek adopts energy-saving formula. This design is superior to the external 5G baseband chip solution which promised to achieve higher transmission rate with lower power consumption and create a comprehensive high-speed 5G solution for smartphones.

Furthermore, it also uses a new AI architecture with a new independent AI processing unit APU to support more advanced AI applications. The chip also included image processing technology that eliminates image blur when the object is moving swiftly.

The general manager of MediaTek stated that consumers have high expectations for 5G. They firmly believe that MediaTek’s 5G mobile platform will provide an unparalleled user experience with its superior architecture, leading image capabilities and powerful AI and ultra-high-speed 5G connection speed.

It is reported that MediaTek’s 5G mobile platform will deliver samples to major customers in the third quarter of 2019. The first batch of 5G terminals equipped with the mobile platform will be available in the first quarter of 2020. The complete technical specifications of MediaTek’s 5G chip will be released in the coming months.